Employment Opportunity

Job Description:

As a Lead Mechanical Engineer, you are a technical leader across multidisciplinary teams 
of engineers to create the best overall system design including thermal design, analysis, 
and test of complex systems operating in harsh space and ground environments.  Lead 
engineers possess in-depth understanding of aerospace thermal engineering technology and 
payload architectures for spacecraft sub-systems and instruments.  These talents are used 
to direct and oversee teams who specialize in conductive, convective, and radiative 
analyses, understanding of heat pipes, radiative heat transfer, and thermal control 
hardware design (thermal blankets, surface treatments, heater tapes, thermistors) and the 
interaction with optical structures in order to minimize optical errors, and achieve 
operational temperatures.  Lead engineers proficiently utilize state of the art custom 
software in conjunction with Thermal Desktop and Finite Element Analysis (FEA) packages 
and often mentor other Thermal Analysts in the use of such tools. 

Essential Functions:

Knowledge of system level thermal design & development, payload level integration and 
test, and risk mitigation for space-based environments
Create and analyze design concepts using FEA & thermal analysis software.
Organization of thermal design and analysis as an IPT lead; frequently interfacing 
directly with customer technical leads and management.
Documenting and presenting design & analysis results to customers at formal gate and 
design reviews.
Development of thermal test plans to manufacture and test payload sensor systems.
Support new business opportunities and mentor junior level staff.
Perform thermal design and analysis tasks on complex mechanical hardware including 
precision mechanisms, electro-mechanical devices, aerospace mechanism design, complex 
electronics packaging, supporting space-based deployable mechanisms, avionics, innovative 
thermal and ground based systems.
Program support also includes requirements derivation and verification, system 
architecture development, loads derivation, trade studies, design sensitivity/optimization 
studies, preliminary and final design analysis, generation of analysis documentation 
(including presentation materials, and deliverable data packages), and leading system test 
activities.
Work multiple tasks in a fast-paced environment and adapt quickly to changing situations.
Qualifications:

Bachelor’s Degree and minimum 9 years of prior relevant experience. Graduate Degree and a 
minimum of 7 years of prior related experience. In lieu of a degree, minimum of 13 years 
of prior related experience.
Proficiency in thermal analysis tools such as Thermal Desktop (preferred), Sinda, Thermal 
Fluent, Icepak, etc.
Experience with thermal vacuum testing.
Preferred Additional Skills: 

Experience with thermal analysis of mechanical and electronic systems, in space, air or 
ground environments.
Strong analytical skills with emphasis on using and/or directing finite element analysis 
(FEA).
Experience with finite element analysis software.
Able to support design decisions with well documented engineering analyses and 
calculations.
Able to analyze problems and to focus and drive down to the root cause of problems 
quickly.
Experience as a lead engineer, project engineer, or IPT lead is a plus.
Experience with Microsoft office tools, Word, Excel, PowerPoint.
Active Secret Clearance.